| Starts: | Wednesday December 09, 2009 at 1:00pm |
|---|---|
| Ends: | Friday December 11, 2009 at 5:00pm |
| Event Type: | Conference |
| Region: | San Francisco Bay Area |
| Location: |
Hyatt Regency San Francisco Airport Hotel Burlingame, CA US |
| Price: | $1199 |
| Website: | http://techventure.rti.org/Winter2009/ |
| Industry: | semiconductors |
| Keywords: | 3d, 3 D, Tsv, Memory, 3d Packaging, Vias, Logic, Moore's Law, Rti, Multi Chip, Wafer, Bonding, Thinning, Integration, Imaging, Sip, Soc |
| Intended For: | director, manager, president, cto, marketing, engineering, engineer, technology, technologist, research, r&d, vice, vp, scientist, |
| Organization: | RTI International |
Industry leaders will speak at RTI International’s fourth international conference “3-D Architectures for Semiconductor Integration and Packaging” in San Francisco Dec. 9-11.
Held annually since 2002, this conference series has become recognized as the premier gathering of senior technologists and business leaders involved in 3-D integration and packaging.
This year’s event features nearly 30 invited speakers during the conference and pre-conference symposium, presenting on the impact of the latest technology and market developments.
Included are distinguished keynote presentations from Jerry Bautista, director of technology management, Microprocessor Research Laboratory, Intel; Douglas Yu, senior director of Integrated Interconnect and Packaging, TSMC; John Knickerbocker, distinguished engineer manager: System on Package and 3-D Integration, IBM; Ho-Ming Tong, chief R&D officer and general manger of group R&D, ASE Group; Raj Pendse, vice president, Technology Group, STATS ChipPAC; Ron Huemoeller, vice president Advanced Interconnect, Amkor Technology.
This year’s conference will provide attendees and speakers the unique opportunity to explore and understand the technology and business implications of the trend toward 3-D device and system integration in the semiconductor industry. Conference Sessions for this year's event include: • The IDM and Foundry Perspective on 3-D Technology Trends and Opportunities • The Packaging Foundry and its Vital Role in Driving 3-D • Looking Over the Horizon - Forecasting Growth • On the Front - Applications Driving 3-D Development and Commercialization • Taking Advantage of 3-D - Rethinking Design Approaches • Industry and Government Funded 3-D Efforts - Key Research Outcomes and Resources • Fundamental Technology Approaches to Building 3-D • Wafer Handling Leads the Way on Manufacturing
The conference targets senior-level technologists, managers, and business executives from the international semiconductor community. It addresses a full range of interests for designers, manufacturers, suppliers, and end users.
bravo !